I, Banned area
78, metal housing devices and heat sinks, should not cause short-circuiting, copper and vias
79, the installation of screws or washers should not be caused around the short circuit of the alignment, copper and through the hole
80, the design requirements in the reservation location whether there is alignment
81, non-metallized hole within the line and the distance between the copper foil should be greater than 0.5mm (20mil), the outer 0.3mm (12mil), veneer pull pull the shaft hole from the line and copper foil spacing should be greater than 2mm (80mil )
82, copper and wire to the edge of the board is recommended to be greater than 2mm minimum 0.5mm
83, the inner layer of copper to the edge of the board 1 ~ 2 mm, the smallest 0.5mm
J. Wire outlet
84, for the two pads installed CHIP components (0805 and below package), such as resistors, capacitors, and its pad connected to the pad line is best from the center of the pad symmetrical lead out, and printed with the pad Line must have the same width, for the line width of less than 0.3mm (12mil) of the lead wire can not consider this provision
85, with a wider lead wire connected to the pad, the middle of the best through a narrow line of the transition? (0805 and below)
86, the line should be as far as possible from the SOIC, PLCC, QFP, SOT and other devices at both ends of the lead
K. Silk screen
87, whether the device bit number is missing, the location can correctly identify the device
88, device bit number is in line with company standards
89, confirm the device pin order, the first foot sign, the polarity of the device logo, the correct orientation of the direction of the connector
90, whether the identification of the board and the board is corresponding to the orientation of the board
91, whether the backplane correctly identifies the slot name, slot number, port name, jacket direction
92, to confirm the design requirements of the silk screen to add is correct
93, confirmed that the anti-static and RF board logo (RF board use)
Encoding / barcode
94, confirm that the PCB code is correct and in line with company specifications
95, confirm the board PCB coding location and level is correct (should be in the top left side of the A, silk screen layer)
96, confirm the PCB location of the backplane and the level of the correct (should be in the top right B, the outer copper foil surface)
97, confirm that there are bar code laser printing white silk screen marked area
98, check the bar code box below no connection and more than 0.5mm through hole
99, to confirm the bar code outside the white silk screen area 20mm can not have a height of more than 25mm components
100, in the reflow surface, the hole can not be designed on the pad. (The distance between the hole and the pad of the normal window should be greater than 0.5mm (20mil), the distance between the green oil covered hole and the pad should be greater than 0.1mm (4mil). Method: Open the Same Net DRC, check the DRC, Then close Same Net DRC)
101, the arrangement of the hole should not be too dense, to avoid causing power, ground plane large-scale fracture
102, the hole diameter of the hole is preferably not less than 1/10 of the plate thickness
103, device placement rate is 100%, cloth rate is 100% (not up to 100% of the need to note in the note)
104, whether the Dangling line has been adjusted to a minimum and has been confirmed for the reserved Dangling line;
105, the technical section of the feedback process has been carefully checked
O. Large area copper foil
106, for the Top, the bottom of the large area of ​​copper foil, if no special needs, the application of grid copper [board with inclined net, backplane with orthogonal network, line width 0.3mm (12 mil), spacing 0.5mm ( 20mil)]
107, a large area of ​​copper foil area of ​​the device pads, should be designed to wear pad, so as to avoid Weld; have current requirements, the first consideration to widen the pad of the pad, and then consider the full connection
108, a large area of ​​copper, you should try to avoid there is no network connection of the dead copper (island)
109, a large area of ​​copper foil also need to pay attention to whether there is illegal connection, not reported DRC
P. Test points
110, a variety of power, ground test points are sufficient (every 2A current at least one test point)
111, to confirm that no network of test sites are confirmed to be streamlined
112, make sure that there is no test point on the plug-in that is not installed at production time
113, Test Via, Test Pin Yes Fix (for test bed unchanged)
114, Test via and Test pin Spacing Rule should be set to the recommended distance, check the DRC, if there is still DRC exists, and then check the minimum distance to check the DRC
115, open the constraint set to open, update the DRC, see if there is no permission in the DRC error
116, confirm that the DRC has been adjusted to a minimum, for the DRC can not be eliminated to confirm;
R. Optical positioning point
117, confirm that the PCB surface of the mounting element has an optical positioning symbol
118, confirm the optical positioning symbol is not pressure line (silk screen and copper wire alignment)
119, the optical positioning point background to be the same, to confirm the use of the entire optical point of the central side of the edge ≥ 5mm
120, it is confirmed that the optical positioning reference symbol for the entire board has been assigned a coordinate value (it is recommended that the optical positioning reference symbol be placed in the form of a device) and is an integer value in millimeters.
121, ICs with a center center distance of <0.5mm, and a BGA device with a center distance of less than 0.8 mm (31 mil) shall be provided with an optical positioning point near the diagonal of the component
Sewing inspection
122, to confirm whether there is a special type of demand for the type of pad are the right window (with particular attention to the hardware design requirements)
123, BGA under the hole is handled into a cover plug hole
124, in addition to the test hole outside the hole has been done to open a small window or oil plug hole
125, the optical positioning of the window to avoid the exposed copper and exposed
126, power chip, crystal, etc. to be copper heat dissipation or grounding shielding devices, whether the copper and the correct window. The soldering device should have a green oil to block the large area of ​​solder diffusion
Fourth, the processing of documents
127, PCB thickness of the Notes, the number of layers, the color of silk screen, warpage, and other technical instructions are correct
128, stack plate name, stack order, media thickness, copper foil thickness is correct; whether to require impedance control, description is accurate. The layer name of the stack is consistent with its light-painted file name
129, will set the table in the Repeat code off, drilling accuracy should be set to 2-5
130, hole table and drilling files are up-to-date (change holes must be regenerated)
131, hole table whether there are abnormal pore size, crimping the aperture is correct; aperture tolerance is marked correctly
132, the hole of the hole is listed separately, and marked "filled vias"
133, light drawing file output as far as possible using RS274X format, and the accuracy should be set to 5: 5
134, art_aper.txt whether the latest (274X can not need)
135, the output light painting file log file whether there are abnormal reports
136, the edge of the negative layer and island confirmed
137, use the light-painted check tool to check whether the light-painted file matches the PCB (the board is to use the comparison tool)
Fifth, the file set
138, PCB file: Product model _ Specifications _ Board code _ version number. Brd
139, backing plate design file: Model _ Specifications _ Board code _ version number-CB [-T / B] .brd
140, PCB processing documents: PCB coding. Zip (including the layers of the light painted files, aperture table, drilling files and ncdrill.log; puzzle also need to provide the puzzle file *. Dxf), the backplane also Additional Liner File: PCB Code -CB [-T / B] .zip (with drill.art, *. Drl, ncdrill.log)
141, process design documents: product model _ specifications _ board code _ version number-GY.doc
142, SMT Coordinate file: Product model _ Specification _ Board code _ Version number --MT.txt, (When the coordinate file is output, confirm the selection of Body center. Only when confirming that the origin of all SMD device libraries is the device center Symbol origin
143, PCB board structure file: product model _ specifications _ board code _ version number - MCAD.zip (including structural engineers to provide. DXF and .EMN file)
144, test file: product model _ specifications _ board code _ version number-TEST.ZIP (including testprep.log and untest.lst or *. Drl test point coordinate file)
145, Archive drawings Documents: Model specifications - Board name - version number .pdf, (including: cover, home page, each layer of silk screen, the layers of lines, drilling, backplane with liner)
Sixth, standardization
146, confirm the cover, the first page information is correct
147, confirm the drawing number (corresponding to the PCB layers of the distribution) the correct
148, confirm that the PCB code on the drawing frame is correct