In the PCB design, you can layer, the appropriate layout and wiring and installation of PCB anti-ESD design. In the design process, through the prediction can be the vast majority of design changes are limited to increase or decrease components. By adjusting the PCB layout and wiring, can be a good way to prevent ESD.

Static electricity from the human body, the environment and even the electronic equipment can cause damage to the sophisticated semiconductor chip, such as penetrating the thin layer inside the component; damage the gate of the MOSFET and the CMOS component; the trigger in the CMOS device is locked ; Short-circuit reverse bias PN junction; short-circuit forward bias PN junction; melting active devices within the welding line or aluminum. In order to eliminate the electrostatic discharge (ESD) on the interference of electronic equipment and damage, need to take a variety of technical means to prevent.

In the design of the PCB board, you can layer, the appropriate layout and installation and installation of PCB anti-ESD design. In the design process, through the prediction can be the vast majority of design changes are limited to increase or decrease components. By adjusting the PCB layout and wiring, can be a good way to prevent ESD. Here are some common precautions.

As far as possible the use of multi-layer PCB, relative to the double-sided PCB, the ground plane and power plane, as well as the arrangement of the signal line - ground spacing can reduce the common mode impedance and inductive coupling, so that double- 10 to 1/100. As far as possible to each signal layer are close to a power layer or ground layer. For the top and bottom surface components, with a short cable and many filled with high-density PCB, you can consider using the inner line.

For double-sided PCB, use a tightly interconnected power supply and ground grid. The power cord is close to the ground, and between the vertical and horizontal or fill areas, connect as much as possible. One side of the grid size is less than or equal to 60mm, if possible, the grid size should be less than 13mm.

Make sure every circuit is as compact as possible.
 
Place all connectors as far as possible.

If possible, introduce the power cord from the center of the card and away from areas that are easily affected by ESD directly.  

On all PCB layers underneath the connector outside the chassis (easily accessible directly by ESD), place a wide chassis or polygonal fill and connect them together at a distance of about 13 mm.
 
Place the mounting holes on the edges of the card, and the mounting holes are connected to the chassis floor with the top and bottom pads of the solder resist.
 
When assembling the PCB, do not coat any solder on the top or bottom pad. Use screws with built-in washers to achieve close contact between the PCB and the metal chassis / shield or ground support.  

Between the chassis ground and the circuit ground of each floor, the same "isolation zone" should be set; if possible, keep the separation distance 0.64mm.  

At the top and bottom of the card near the mounting hole, every 100mm along the chassis ground to the chassis and the circuit with 1.27mm wide line together. Place adjacent to these connection points, place a pad or mounting hole for mounting between the chassis ground and the circuit ground. These ground connections can be opened with a blade to keep open, or jump with a bead / high frequency capacitor.  
 
If the circuit board is not placed in a metal chassis or shield, the solder can not be coated on the top and bottom chassis ground of the board so that they can act as discharge electrodes for ESD arcs.  
Place a ring around the circuit in the following ways:
 
(1) In addition to the edge connector and the chassis ground, around the entire periphery around the circular path.  

(2) Ensure that the width of all layers is greater than 2.5mm.
 
(3) every 13mm with holes will be ring connected.
 
(4) will be connected to the public ground of the multilayer circuit.