First, the overlap of pads

1, the overlap of the pad (except for the surface of the pad) means that the hole is overlapped and the hole is damaged due to drilling in a drilling process.

2, multi-layer board in the two holes overlap, such as a hole for the isolation disk, another hole for the connection plate (flower pad), so that after the film showed the isolation disk, resulting in scrapped.

Second, the abuse of graphics layer

1, in some graphics layer to do some useless connection, was originally a four-story board is designed more than five lines, causing misunderstanding.

2, the design time to save trouble to Protel software, for example, the layers of the line with the Board to draw, but also with the Board layer to draw lines, so that when the light painting data, because the unselected board layer, missed Connected to the circuit, or because the choice of Board layer of the marked line and short circuit, so the design to maintain the graphics layer is complete and clear.

3, in violation of conventional design, such as component design in the Bottom layer, welding surface design in the Top, causing inconvenience.

Third, the character of the mess

1, character pad pad SMD solder pads, to the printed circuit board on and off testing and component welding inconvenience.

2, the character design is too small, resulting in the difficulties of screen printing, too large characters will overlap each other, it is difficult to distinguish.

Fourth, single-sided pad aperture settings
 
1, single-sided pad is generally not drilling, if the hole to be marked, the aperture should be designed to zero. If a numerical value is designed so that the hole is generated at this position when the drilling data is generated, there is a problem.

2, single-sided welding, such as drilling should be special marked.

Fifth, fill the pad with padding
 
The pad can not be directly generated by the DRC inspection, but it is not possible for the machining. Therefore, the pad can not directly generate the solder resist data. When the solder resist is applied, the filler block area will be covered by the solder resist, resulting in Device welding difficult.

Six, electric stratigraphy is to wear pad is connected
 
Because the design of the way to wear the power of the pad, the formation and the actual printed circuit board image is the opposite, all the lines are isolated lines, which designers should be very clear. Here by the way, to draw a few sets of power or several kinds of ground isolation line should be careful not to leave a gap, so that two sets of power short circuit, can not cause the connection of the regional block (so that a group of power is separated).

Seven, the definition of processing level is not clear
 
1, single-panel design in the TOP layer, if not explain the pros and cons, perhaps the system out of the board to install the device and not welding.

2, for example, a four-layer design using TOP mid1, mid2 bottom four, but the processing is not placed in this order, which requires instructions. The same time as

Eight, the design of the fill block too much or fill the block with a very fine line filled
 
1, resulting in the phenomenon of light-painted data loss, light-painted data is not complete.

2, because the fill block in the light-painted data processing is a line with a painting, so the amount of light generated data is quite large, increasing the difficulty of data processing.

Nine, surface mount device pads are too short
 
This is for the on-off test, for too dense surface mount devices, the spacing between their feet is quite small, the pad is also quite fine, the installation of test pins, must be up and down (left and right) staggered position, such as pad The design is too short, although it does not affect the device installation, but will make the test pin wrong bit.

Ten, large area grid spacing is too small
 
(Between less than 0.3mm), in the process of manufacturing the printed circuit board, the drawing process is easy to produce a lot of crushing film attached to the board, resulting in disconnection.

Eleven, a large area of ​​copper from the frame too close
 
Large area copper foil from the frame should be at least guaranteed to more than 0.2mm spacing, because in the milling shape, such as milling to the copper foil is likely to cause the copper from the Alice and caused by the solder loss problems.

Twelve, the shape of the border design is not clear
 
Some customers in the Keep layer, Board layer, Top over layer and so on the design of the contour line and these lines do not coincide, resulting in PCB manufacturers is difficult to determine which shape line prevail.

Thirteen, graphic design is not uniform
 
In the graphics plating caused by uneven coating, affecting the quality.

Fourteen, shaped holes are too short
 
The length / width of the shaped hole should be ≥2: 1, the width should be> 1.0mm, otherwise, the drilling machine in the processing of special-shaped hole easily broken drill, resulting in processing difficulties, increase costs.